View BU97510CKV-ME2_8442059.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/28 tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 tsz22111 ? 14 ? 001 www.rohm.com ?? ? ? ? ? ? ?? ? ? ? lcd segment drivers multi- function lcd segment drivers bu97510ckv-m max 216 segment(54segx4com) general description the bu97510ckv-m is 1/4 or 1/3-duty general-purpose lcd driver that can be used for frequency display in electronic tuners under the co ntrol of a microcontroller. the bu97510ckv-m can drive up to 216 lcd. segments directly. the bu97510ckv-m can also control up to 6 general-purpose output ports. features ? aec-q100 qualified (note) ? either 1/4 or 1/3-duty can be selected with the serial control data. 1/4-duty drive: up to 216 segments 1/3-duty drive: up to 162 segments ? serial data control of frame frequency for common and segment output waveforms. ? serial data control of switching between the segment output port , pwm output port and general-purpose output port functions.(max 6 port) ? built-in osc circuit ? the inhb pin can force the display to the off state. ? integrated power-on reset circuit ? no external component ? low power consumption design (note) grade 3 applications ? car audio, home electrical appliance, meter equipment etc. key specifications ? supply voltage range: ? operating temperature range: ? max segments: ? display duty: ? bias: ? interface: +2.7v to +6.0v -40c to +85c 216 segments 1/3, 1/4 selectable1/2, 1/3 selectable 3wire serial interface packages vqfp64 w(typ.) d(typ.) h(max.) typical application circuit figure 1. typical application circuit v qfp64 12.00mm x 12.00mm x 1.60mm (p1/g1) +5v from controller (general purpose/pwm ports) (for use control of backlight) (note) insert capacitors between vdd and vss c 0.1uf lcd panel (up to 216 segments) vdd inhb sce scl sdi com1com2 com3 s1/p1/g1 s2/p2/g2 s6 / p6/g6 s7 osc/s52 (p6/g6) (note) s51 s54 s53 com4 downloaded from: http:///
2/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 block diagram figure 2. block diagram pin arrangement figure 3. pin configuration (top view) vdet scl sdi vss serial ? interface vdd lcd ? voltage ? generator shift ? register segment ? driver/latch ? pwm ? register control ? register s1/p1/g1 s6/p6/g6 s7 s53 s54 common ? driver clock ? /timing generator inhb com3 com4 com1 com2 ???? ????? s52/osc sce vlcd vlcd1 vlcd2 downloaded from: http:///
3/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings(ta = 25c, vss = 0.0v) parameter symbol conditions ratings unit maximum supply voltage vdd max vdd -0.3 to +6.5 v input voltage vin1 sce, scl, sdi, inhb -0.3 to +6.5 v allowable loss pd 1.0 (n o t e ) w operating temperature topr -40 to +85 c storage temperature tstg -55 to +125 c (note) when use more than ta=25c, subtract 10mw per degree. (using rohm standard board) (board size: 70mm70mm1.6mm material: fr4 board copper foil: land pattern only) caution: operating the ic over absolute maximum ratings may damage the ic . the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = -40 to +85c, vss = 0.0v) parameter symbol conditions ratings unit min typ max supply voltage vdd vdd 2.7 6.0 v electrical characteristics (ta = -40 to +85c, vdd = 2.7v to 6.0v, vss = 0.0v) parameter symbol pin conditions ratings unit min typ max hysteresis vh sce, scl, sdi, inhb, osc - 0.03vdd - v power-on detection voltage vdet vdd 1.4 1.8 2.2 v h level input voltage vih1 sce, scl, sdi, inhb, osc vdd=4.0v to 6.0v 0.4vdd - vdd v vih2 sce, scl, sdi, inhb, osc vdd=2.7v to 4.0v 0.8vdd - vdd v l level input voltage vil1 sce, scl, sdi, inhb, osc 0 - 0.2vdd v h level input current iih1 sce, scl, sdi, inhb, osc vi = 6.0v - - 5.0 a l level input current iil1 sce, scl, sdi, inhb, osc vi = 0v -5.0 - - a h level output voltage voh1 s1 to s54 io = -20a vdd-0.9 - - v voh2 com1 to com4 io = -100a vdd-0.9 - - voh3 p1/g1 to p6/g6 io = -1ma vdd-0.9 - - l level output voltage vol1 s1 to s54 io = 20a - - 0.9 v vol2 com1 to com4 io = 100a - - 0.9 vol3 p1/g1 to p6/g6 io = 1ma - - 0.9 middle level output voltage vmid1 s1 to s54 1/2-bias io = 20a 1/2vdd -0.9 - 1/2vdd +0.9 v vmid2 com1 to com4 1/2-bias io = 100a 1/2vdd -0.9 - 1/2vdd +0.9 vmid3 s1 to s54 1/3-bias io = 20a 2/3vdd -0.9 - 2/3vdd +0.9 vmid4 s1 to s54 1/3-bias io = 20a 1/3vdd -0.9 - 1/3vdd +0.9 vmid5 com1 to com4 1/3-bias io = 100a 2/3vdd -0.9 - 2/3vdd +0.9 vmid6 com1 to com4 1/3-bias io = 100a 1/3vdd -0.9 - 1/3vdd +0.9 current drain idd1 vdd power-saving mode - - 15 a idd2 vdd vdd = 5.0v output open 1/2-bias frame frequency = 80hz - 70 150 idd3 vdd vdd = 5.0v output open 1/3-bias frame frequency = 80hz - 95 200 downloaded from: http:///
4/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 oscillation characteristics (ta = -40 to +85c, vdd = 2.7v to 6.0v, vss = 0.0v) parameter symbol pin conditions ratings unit min typ max oscillator frequency1 fosc1 internal oscillator circuit vdd = 2.7v to 6.0v 150 - 360 khz oscillator frequency2 fosc2 vdd = 5.0v 255 300 345 khz external clock frequency (note3) fosc3 osc external clock mode (oc=1) 30 - 600 khz (note3) frame frequency is decided external fr equency and dividing ratio of fc0-2 setting. reference data figure 4. typical temperature characteristics 150 180 210 240 270 300 330 -40 -20 0 20 40 60 80 tempe rature[c] fosc[khz] vdd = 6.0v vdd = 5.0v vdd = 3.3v vdd = 2.7v downloaded from: http:///
5/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 mpu interface characteristics (ta = -40 to +85c, vdd = 2.7v to 6.0v, vss = 0.0v) parameter symbol pin conditions ratings unit min typ max data setup time tds scl, sdi 160 - - ns data hold time tdh scl, sdi 160 - - ns sce wait time tcp sce, scl 160 - - ns sce setup time tcs sce, scl 160 - - ns sce hold time tch sce, scl 160 - - ns high-level clock pulse width tchw scl 160 - - ns low-level clock pulse width tclw scl 160 - - ns rise time tr sce, scl, sdi - 160 - ns fall time tf sce, scl, sdi - 160 - ns inh switching time tc inhb, sce 10 - - s 1. when scl is stopped at the low level sdi scescl vih1 50% vil1 vih1 vil1 tds tdh tchw tclw tr tf tcp tcs v ih 1 tch v il 1 2. when scl is stopped at the high level sdi sce scl vih1 50% vil1 tds tdh tclw tchw tf tr tcp tcs v ih 1 tch v il 1 v ih 1 v il 1 figure 5.serial interface timing downloaded from: http:///
6/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 pin description symbol pin no. function active i/o handling when unused s1/p1/g1 to s6/p6/g6 s7 to s54 1 to 6 7 to 50 55,57,58 segment output. the s1/p1/g1 to s6/p6/g6 pins can be used as general Cpurpose outputs. - o open com1 to com4 51 to 54 common driver output pins. the frame frequency is fo[hz]. - o open s52/osc 60 segment output. the pin s52/osc can be used external frequency input pin when set up by the control data. - i/o open sce scl sdi 62 63 64 serial data transfer inputs. must be connected to the controller. sce: chip enable scl: synchronization clock sdi: transfer data h - i i i gnd inhb 61 display off control input inhb = low (vss) ...display forced off s1/p1/g1 to s6/p 6/g6 = low (vss) s7 to s54 = low (vss) com1 to com4 = low (vss) shuts off current to the lcd drive bias voltage generation divider resistors. stop the internal oscillation circuit. inhb = high (vdd)...display on however, serial data transfer is possible when the display is forced off. l i vdd v dd 56 power supply pin for the logic circuit block. a power voltage of 2.7v to 6.0v must be applied to this pin. - - - v ss 59 power supply pin. must be connected to ground. - - - io equivalence circuit figure 6. i/o equivalence circuit vdd vss s52 / osc s1/ pwm1/gpo1~ s6/ pwm6/gpo6 vdd s7~51,53,54 / com1~4 vss vdd vss vdd sce / sdi /scl/ inhb vss vdd vss downloaded from: http:///
7/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 serial data transfer formats 1. 1/4-duty (1) when scl is stopped at the low level figure 7. 3-spi data transfer format note : dd is direction data. sce scl sdi downloaded from: http:///
8/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 (2) when scl is stopped at the high level figure 8. 3-spi data transfer format note : dd is direction data. ? device code ??????????????????????? 41h ? d1 d216 ????????????????????????? display data ? p0 2 ????????????????????????????? segment / pwm / general purpose out put port switching control data ? dr ???????????????????????????????? 1/3-bias drive or 1/2-bias drive switching control data ? dt ???????????????????????????????? 1/4-duty drive or 1/3-duty drive switching control data ? fc0 fc2 ????????????????????????? frame frequency switching control data ? oc ???????????????????????????????? internal oscillator operating mode/external clock operating mode switching control data ? sc ???????????????????????????????? segment on/off switching control data ? bu ???????????????????????????????? normal mode/power-saving mode switching control data ? pg1 pg6 ????????????????????????? pwm/general purpose output switching control data ? pf0 pf3 ?????????????????????????? pwm output waveform frame frequency switching control data ? w10 w15, w20 w25, w30 w35,w40 w45, w50 w55, w60 w65 ?????????????????????????????????? pwm output waveform duty switching control data sce scl sdi downloaded from: http:///
9/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 2. 1/3-duty (1) when scl is stopped at the low level figure 9. 3-spi data transfer format note : dd is direction data. sce scl sdi downloaded from: http:///
10/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 (2) when scl is stopped at the high level figure 10. 3-spi data transfer format note : dd is direction data. ? device code ??????????????????????? 41h ? d1 d162 ????????????????????????? display data ? p0 2 ????????????????????????????? segment / pwm / general purpose out put port switching control data ? dr ???????????????????????????????? 1/3-bias drive or 1/2-bias drive switching control data ? dt ???????????????????????????????? 1/4-duty drive or 1/3-duty drive switching control data ? fc0 fc2 ????????????????????????? frame frequency switching control data ? oc ???????????????????????????????? internal oscillator operating mode/external clock operating mode switching control data ? sc ???????????????????????????????? segment on/off switching control data ? bu ???????????????????????????????? normal mode/power-saving mode switching control data ? pg1 pg6 ????????????????????????? pwm/general purpose output switching control data ? pf0 pf3 ?????????????????????????? pwm output waveform frame frequency switching control data ? w10 w15, w20 w25, w30 w35,w40 w45, w50 w55, w60 w65 ?????????????????????????????????? pwm output waveform duty switching control data sce scl sdi downloaded from: http:///
11/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 control data functions 1.p0 p2:segment / pwm / general purpose output port switching control data these control bits are used to select t he function of the s1/p1 to s6/p6 output pi ns (segment output pins or pwm output pins or general purpose output pins). please refer to the table below. p0 p1 p2 s1/p1/g1 s2/p2/g2 s3/p3/g3 s4/p4/g4 s5/p5/g5 s6/p6/g6 0 0 0 s1 s2 s3 s4 s5 s6 0 0 1 p1/g1 s2 s3 s4 s5 s6 0 1 0 p1/g1 p2/g2 s3 s4 s5 s6 0 1 1 p1/g1 p2/g2 p3/g3 s4 s5 s6 1 0 0 p1/g1 p2/g2 p3/g3 p4/g4 s5 s6 1 0 1 p1/g1 p2/g2 p3 /g3 p4/g4 p5/g5 s6 1 1 0 p1/g1 p2/g2 p3/g3 p4/g4 p5/g5 p6/g6 1 1 1 s1 s2 s3 s4 s5 s6 pwm output or general purpose output is selected by pgx(x=1 6) control data bit. when the general purpose output port function is selected, the correspondence between the output pins and the respective display data is given in the table below. output pins corresponding display data 1/4-duty mode 1/3-duty mode s1/p1/g1 d1 d1 s2/p2/g2 d5 d4 s3/p3/g3 d9 d7 s4/p4/g4 d13 d10 s5/p5/g5 d17 d13 s6/p6/g6 d21 d16 when the general purpose output port function is selected, the respective output pin is output a high level when it corresponding display data is set to 1. likewise, it will output a low level, if its corresponding display data is set to 0. for example, s4/p4/g4 is used as a general purpose output port, if its corresponding display data C d13 is set to 1, then s4/p4/g4 will output high level. likewise, if d13 is set to 0, then s4/p4/g4 will output low level. 2. dr: 1/3-bias drive or 1/2-bias drive switching control data this control data bit selects either 1/3-bias drive or 1/2-bias drive. dr bias drive scheme 0 1/3-bias drive 1 1/2-bias drive 3. dt: 1/4-duty drive or 1/3-du ty drive switching control data this control data bit selects either 1/4-duty drive or 1/3-duty drive. dt duty drive scheme 0 1/4-duty drive 1 1/3-duty drive 4. fc0, fc1, fc2: frame fr equency switching control data these control data bits set the frame frequency for common and segment output waveforms. fc0 fc1 fc2 frame frequency fo(hz) 0 0 0 fosc/6144 0 0 1 fosc/5376 0 1 0 fosc/4608 0 1 1 fosc/3840 1 0 0 fosc/3072 1 0 1 fosc/2304 1 1 0 fosc/1920 1 1 1 fosc/1536 note: fosc: internal oscillation frequency (300 [khz] typ.) 5. oc: internal oscillator operating mode/ext ernal clock operating mode switching control data oc operating mode in/out pin(s52/osc) status 0 internal oscillator s52 (segment output) 1 external clock osc (clock input) downloaded from: http:///
12/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 6. sc: segment on/off switching control data this control data bit controls the on/off state of the segments. sc display state 0 on 1 off note that when the segments are turned off by setting sc to 1, the segments are turned off by outputting segment off waveforms from the segment output pins. 7. bu: normal mode/power-saving mode switching control data this control data bit selects either normal mode or power-saving mode. bu mode 0 normal mode 1 power-saving mode power-saving mode status: s1/p1/g1 to s6 /p6/g6 = active only general purpose output s7 to s54 = low(vss) com1 to com4 = low(vss) shut off current to the lcd drive bias voltage generation circuit stop the internal oscillation circuit however , serial data transfer is possible when power-saving mode. 8. pg1, pg2, pg3, pg4, pg 5, pg6: pwm/general purpose output switching control data this control data bit select either pwm output or general purpose output of sx/px/gx pins.(x=1 6) pgx(x=1 6) mode 0 pwm output 1 general purpose output gpo changing function> normal behavior of changing gpo to pwm is below. - pwm operation is started by command import timing of dd: 01 during gpo ---> pwm change. - please take care of reflect timing of new duty setting of dd: 10, dd: 11 is from the next pwm. in order to avoid this operation, please input commands reversely as below. sce dd: 00 dd: 01 dd: 10 dd: 11 gpo ?\\\ > ? pwm ? change new ? duty ? decided ? timing start ? of ? pwm ? operation (pwm ? waveform ? in ? immediate ? duty) next ? pwm ? cycle (pwm ? waveform ? in ? new ? duty) pwm/gpo ? output sce dd:11 dd:10 dd:01 dd:00 gpo ?\\ pwm ? change new ? duty ? decided ? timing start ? of ? pwm ? operation (pwm ? waveform ? on ? new ? duty) pwm/gpo ? output downloaded from: http:///
13/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 9. pf0, pf1, pf2, pf3: pwm output waveform frame frequency switching control data these control data bits set the fram e frequency for pwm output waveforms. pf0 pf1 pf2 pf3 pwm output frame frequency fp(hz) 0 0 0 0 fosc/2048 0 0 0 1 fosc/1920 0 0 1 0 fosc/1792 0 0 1 1 fosc/1664 0 1 0 0 fosc/1536 0 1 0 1 fosc/1408 0 1 1 0 fosc/1280 0 1 1 1 fosc/1152 1 0 0 0 fosc/1024 1 0 0 1 fosc/896 1 0 1 0 fosc/768 1 0 1 1 fosc/640 1 1 0 0 fosc/512 1 1 0 1 fosc/384 1 1 1 0 fosc/256 1 1 1 1 fosc/128 10.w10 w15, w20 w25, w30 w35, w40 w45, w50 w55, w60 w65: pwm output waveform duty switching control data these control data bits set the high level pulse width(duty) for pwm output waveforms. wn0 wn1 wn2 wn3 wn4 wn5 pwm duty 0 0 0 0 0 0 (1/64) x tp 1 0 0 0 0 0 (2/64) x tp 0 1 0 0 0 0 (3/64) x tp 1 1 0 0 0 0 (4/64) x tp 0 0 1 0 0 0 (5/64) x tp 1 0 1 0 0 0 (6/64) x tp 0 1 1 0 0 0 (7/64) x tp 1 1 1 0 0 0 (8/64) x tp 0 0 0 1 0 0 (9/64) x tp 1 0 0 1 0 0 (10/64) x tp 0 1 0 1 0 0 (11/64) x tp 1 1 0 1 0 0 (12/64) x tp 0 0 1 1 0 0 (13/64) x tp 1 0 1 1 0 0 (14/64) x tp 0 1 1 1 0 0 (15/64) x tp 1 1 1 1 0 0 (16/64) x tp 0 0 0 0 1 0 (17/64) x tp 1 0 0 0 1 0 (18/64) x tp 0 1 0 0 1 0 (19/64) x tp 1 1 0 0 1 0 (20/64) x tp 0 0 1 0 1 0 (21/64) x tp 1 0 1 0 1 0 (22/64) x tp 0 1 1 0 1 0 (23/64) x tp 1 1 1 0 1 0 (24/64) x tp 0 0 0 1 1 0 (25/64) x tp 1 0 0 1 1 0 (26/64) x tp 0 1 0 1 1 0 (27/64) x tp 1 1 0 1 1 0 (28/64) x tp 0 0 1 1 1 0 (29/64) x tp 1 0 1 1 1 0 (30/64) x tp 0 1 1 1 1 0 (31/64) x tp 1 1 1 1 1 0 (32/64) x tp wn0 wn1 wn2 wn3 wn4 wn5 pwm duty 0 0 0 0 0 1 (33/64) x tp 1 0 0 0 0 1 (34/64) x tp 0 1 0 0 0 1 (35/64) x tp 1 1 0 0 0 1 (36/64) x tp 0 0 1 0 0 1 (37/64) x tp 1 0 1 0 0 1 (38/64) x tp 0 1 1 0 0 1 (39/64) x tp 1 1 1 0 0 1 (40/64) x tp 0 0 0 1 0 1 (41/64) x tp 1 0 0 1 0 1 (42/64) x tp 0 1 0 1 0 1 (43/64) x tp 1 1 0 1 0 1 (44/64) x tp 0 0 1 1 0 1 (45/64) x tp 1 0 1 1 0 1 (46/64) x tp 0 1 1 1 0 1 (47/64) x tp 1 1 1 1 0 1 (48/64) x tp 0 0 0 0 1 1 (49/64) x tp 1 0 0 0 1 1 (50/64) x tp 0 1 0 0 1 1 (51/64) x tp 1 1 0 0 1 1 (52/64) x tp 0 0 1 0 1 1 (53/64) x tp 1 0 1 0 1 1 (54/64) x tp 0 1 1 0 1 1 (55/64) x tp 1 1 1 0 1 1 (56/64) x tp 0 0 0 1 1 1 (57/64) x tp 1 0 0 1 1 1 (58/64) x tp 0 1 0 1 1 1 (59/64) x tp 1 1 0 1 1 1 (60/64) x tp 0 0 1 1 1 1 (61/64) x tp 1 0 1 1 1 1 (62/64) x tp 0 1 1 1 1 1 (63/64) x tp 1 1 1 1 1 1 (64/64) x tp note:w10 w15:s1/p1/g1 pwm duty data n = 1 6 w20 w25:s2/p2/g2 pwm duty data tp = 1/fp w30 w35:s3/p3/g3 pwm duty data w40 w45:s4/p4/g4 pwm duty data w50 w55:s5/p5/g5 pwm duty data w60 w65:s6/p6/g6 pwm duty data downloaded from: http:///
14/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 display data and output pin correspondence 1. 1/4-duty output pin com1 com2 com3 com4 s1/p1/g1 d1 d2 d3 d4 s2/p2/g2 d5 d6 d7 d8 s3/p3/g3 d9 d10 d11 d12 s4/p4/g4 d13 d14 d15 d16 s5/p5/g5 d17 d18 d19 d20 s6/p6/g6 d21 d22 d23 d24 s7 d25 d26 d27 d28 s8 d29 d30 d31 d32 s9 d33 d34 d35 d36 s10 d37 d38 d39 d40 s11 d41 d42 d43 d44 s12 d45 d46 d47 d48 s13 d49 d50 d51 d52 s14 d53 d54 d55 d56 s15 d57 d58 d59 d60 s16 d61 d62 d63 d64 s17 d65 d66 d67 d68 s18 d69 d70 d71 d72 s19 d73 d74 d75 d76 s20 d77 d78 d79 d80 s21 d81 d82 d83 d84 s22 d85 d86 d87 d88 s23 d89 d90 d91 d92 s24 d93 d94 d95 d96 s25 d97 d98 d99 d100 s26 d101 d102 d103 d104 s27 d105 d106 d107 d108 s28 d109 d110 d111 d112 s29 d113 d114 d115 d116 s30 d117 d118 d119 d120 s31 d121 d122 d123 d124 s32 d125 d126 d127 d128 s33 d129 d130 d131 d132 s34 d133 d134 d135 d136 s35 d137 d138 d139 d140 s36 d141 d142 d143 d144 s37 d145 d146 d147 d148 s38 d149 d150 d151 d152 s39 d153 d154 d155 d156 s40 d157 d158 d159 d160 s41 d161 d162 d163 d164 s42 d165 d166 d167 d168 s43 d169 d170 d171 d172 s44 d173 d174 d175 d176 s45 d177 d178 d179 d180 s46 d181 d182 d183 d184 s47 d185 d186 d187 d188 s48 d189 d190 d191 d192 s49 d193 d194 d195 d196 s50 d197 d198 d199 d200 s51 d201 d202 d203 d204 s52 d205 d206 d207 d208 s53 d209 d210 d211 d212 s54 d213 d214 d215 d216 note: the segment output port function is assumed to be selected for the output pins C s1/p1/g1 to s6/p6/g6. downloaded from: http:///
15/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 to illustrate further, the states of the s 21 output pin is given in the table below. display data state of s21 output pin d81 d82 d83 d84 0 0 0 0 lcd segments corresponding to com1 to com4 are off. 0 0 0 1 lcd segment corresponding to com4 is on. 0 0 1 0 lcd segment corresponding to com3 is on. 0 0 1 1 lcd segments corresponding to com3 and com4 are on. 0 1 0 0 lcd segment corresponding to com2 is on. 0 1 0 1 lcd segments corresponding to com2 and com4 are on. 0 1 1 0 lcd segments corresponding to com2 and com3 are on. 0 1 1 1 lcd segments corresponding to com2, com3 and com4 are on. 1 0 0 0 lcd segment corresponding to com1 is on. 1 0 0 1 lcd segments corresponding to com1 and com4 are on. 1 0 1 0 lcd segments corresponding to com1 and com3 are on. 1 0 1 1 lcd segments corresponding to com1, com3 and com4 are on. 1 1 0 0 lcd segments corresponding to com1 and com2 are on. 1 1 0 1 lcd segments corresponding to com1, com2, and com4 are on. 1 1 1 0 lcd segments corresponding to com1, com2, and com3 are on. 1 1 1 1 lcd segments corresponding to com1 to com 4 are on. downloaded from: http:///
16/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 2. 1/3-duty output pin com1 com2 com3 s1/p1/g1 d1 d2 d3 s2/p2/g2 d4 d5 d6 s3/p3/g3 d7 d8 d9 s4/p4/g4 d10 d11 d12 s5/p5/g5 d13 d14 d15 s6/p6/g6 d16 d17 d18 s7 d19 d20 d21 s8 d22 d23 d24 s9 d25 d26 d27 s10 d28 d29 d30 s11 d31 d32 d33 s12 d34 d35 d36 s13 d37 d38 d39 s14 d40 d41 d42 s15 d43 d44 d45 s16 d46 d47 d48 s17 d49 d50 d51 s18 d52 d53 d54 s19 d55 d56 d57 s20 d58 d59 d60 s21 d61 d62 d63 s22 d64 d65 d66 s23 d67 d68 d69 s24 d70 d71 d72 s25 d73 d74 d75 s26 d76 d77 d78 s27 d79 d80 d81 s28 d82 d83 d84 s29 d85 d85 d87 s30 d88 d89 d90 s31 d91 d92 d93 s32 d94 d95 d96 s33 d97 d98 d99 s34 d100 d101 d102 s35 d103 d104 d105 s36 d106 d107 d108 s37 d109 d110 d111 s38 d112 d113 d114 s39 d115 d116 d117 s40 d118 d119 d120 s41 d121 d122 d123 s42 d124 d125 d126 s43 d127 d128 d129 s44 d130 d131 d132 s45 d133 d134 d135 s46 d136 d137 d138 s47 d139 d140 d141 s48 d142 d143 d144 s49 d145 d146 d147 s50 d148 d149 d150 s51 d151 d152 d153 s52 d154 d155 d156 s53 d157 d158 d159 s54 d160 d161 d162 note: the segment output port function is assumed to be selected for the output pins C s1/p1/g1 to s6/p6/g6. downloaded from: http:///
17/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 to illustrate further, the states of the s 21 output pin is given in the table below. display data state of s21 output pin d61 d62 d63 0 0 0 lcd segments corresponding to com1 to com3 are off. 0 0 1 lcd segment corresponding to com3 is on. 0 1 0 lcd segment corresponding to com2 is on. 0 1 1 lcd segments corresponding to com2 and com3 are on. 1 0 0 lcd segment corresponding to com1 is on. 1 0 1 lcd segments corresponding to com1 and com3 are on. 1 1 0 lcd segments corresponding to com1 and com2 are on. 1 1 1 lcd segments corresponding to com1, com2 and com3 are on. downloaded from: http:///
18/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 output waveforms (1/4-duty 1/3-bias drive scheme) [] , ,, , , , , , figure 11. lcd waveform (1/4-duty, 1/3-bias) downloaded from: http:///
19/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 output waveforms (1/4-duty 1/2-bias drive scheme) [] , , , , , , ,, , , , , , , , , , , , , , , figure 12. lcd waveform (1/4-duty, 1/2-bias) downloaded from: http:///
20/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 output waveforms (1/3-duty 1/3-bias drive scheme) [] , ,, , , figure 13. lcd waveform (1/3-duty, 1/3-bias) com4 function is same as com1 at 1/3-duty. downloaded from: http:///
21/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 output waveforms (1/3-duty 1/2-bias drive scheme) [] , , , , , , , , , , , , , , figure 14. lcd waveform (1/3-duty, 1/2-bias) com4 function is same as com1 at 1/3-duty. downloaded from: http:///
22/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 the inhb pin and display control since the ic internal data (1/4-duty: the display data d1 to d216 and the control data, 1/3-duty: the display data d1 to d162 and the control data) is undefined when power is first applied, applications should set the inh pin low at the same time as power is applied to turn off the display (this sets the s1/p1/g1 to s6/p6 /g6, s7 to s54, com1 to com4 to the vss level.) and during this period send serial data from the controlle r. the controller should then set the inh pin high after the data transfer has completed. this procedure prev ents meaningless displays at power on. 1. 1/4-duty figure 15. power on/off and inhb control sequence (1/4-duty) 2. 1/3-duty figure 16. power on/off and inhb control sequence (1/3-duty) note: t1 0, tc: min 10us tc v il 1 v il 1 display data and control data transfe r undefined undefined undefined undefined defined defined defined defined t1 undefined undefined undefined undefined v dd inhbsce internal data d1 to d56 ,p0 to p2,dr, dt,oc,fc0 to fc2,sc,bu internal data d58 to d112,pg1 to pg6, pf0 to pf3 internal data (d113 to d164,w10 to w35) internal data (d165 to d216,w40 to w65) tc v il 1 v il 1 display data and control data transfer undefined undefined undefined undefined defined defined defined defined t1 undefined undefined undefined undefined v dd inhb sce internal data d1 to d56 ,p0 to p2,dr, dt,oc,fc0 to fc2,sc,bu internal data d58 to d112,pg1 to pg6, pf0 to pf3 internal data (d113 to d162,w10 to w35) internal data (w40 to w65) downloaded from: http:///
23/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 oscillation stabilization time of the internal oscillation circuit it must be noted that the osc illation of the internal oscillation ci rcuit is unstable for a maximum of 100 s (oscillation stabilization time) after oscillation has started. figure 17. oscillation stabilization time voltage detection type reset circuit (vdet) the voltage detection type reset circuit generates an output signal and resets the system when power is applied for the first time and when voltage drops (that is, for example, t he power supply voltage is less than or equal to the power down detection voltage (vdet = 1.8v typ.). to ensure that this reset function wo rks properly, it is recommended that a capacitor must be connected to the power supply line so that both the power supply voltage (vdd) rise time when power is first applied and the power supply voltage (vdd) fa ll time when the voltage drops are at least 1ms. t2 vdd t1 figure 18. vdet detection timing power supply voltage vdd rise time: t1 > 1ms power supply voltage vdd fall time: t2 > 1ms reset condition when bu97510ckv-m is initialized, the internal status after power supply has been reset as the following table. table 1. control data reset condition instruction at reset condition s1/p1/g1 to s2/p2/g2 pin [p0,p1,p2]=[0,0,0]:all segment output lcd bias dr=0:1/3-bias lcd duty dt=0:1/4-duty display frequency [fc0,fc1 ,fc2]=[0,0,0]:fosc/6144 display clock mode oc=0:internal oscillator lcd display sc=1:off power mode bu=1:power saving mode pwm/gpo output pgx=0:pwm output(x=1 6) pwm frequency [pf0,pf1,pf2,pf3]=[0,0,0,0]: fosc /2048 pwm duty [wn0 wn5]=[0,0,0,0,0,0] :(1/64)xtp(n=1 6,tp=1/fp) oscillation stabilization time (100 [us] max.) oscillation stopped oscillation operation (under normal conditions) 1.if the inhb pin status is switched from "l" to "h" when control data oc = "0" and bu ="0" 2.if the control data bu is set from "1" to "0" when inhb = "h" and control data oc ="0" internal oscill ation circuit downloaded from: http:///
24/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
25/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. fu rthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. data transmission to refrain from data transmission is strongly recommended wh ile power supply is rising up or falling down to prevent from the occurrence of disturbances on transmission and reception. downloaded from: http:///
26/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 ordering information b u 9 7 5 1 0 c k v - m e 2 part number package product rank m: for automotive packaging specification e2: embossed tape and reel (vqfp64) kv : vqfp64 marking diagram vqfp64 (top view) bu97510ckv part number marking lot numbe r 1pin mark downloaded from: http:///
27/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vqfp64 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1000pcs e2 () 1pin unit mm pkg vqfp64 drawing: ex252-5001-1 1pin mark downloaded from: http:///
28/28 datasheet d a t a s h e e t bu97510ckv-m tsz02201-0p4p0d300560-1-2 ? 2014 rohm co., ltd. all rights reserved. 02.apr.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 revision history version date description 001 25.feb.2014 new release 002 31.mar.2014 change the condition of vih1 and vih2 in page 3. 003 02.apr.2015 add note on aec-q100 qualified in page 1. modify inhb handling when unused of pin description in page 6. downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BU97510CKV-ME2

	To Download BU97510CKV-ME2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .